Some components for surface mounting is not possible to
solder in the old-fashioned way.
The connection requires soldering with paste and by heating the card. Reflow soldering. This was ment to test
one methode for this with heating and coling by elements and fans. There were several other problems as applying the
soldering paste at the right spot
and in appropriat amount.

The projekt is put to sleep for now.
There are other ways around this problem.

A very complicated task is to
evaluate if an idé is possibel to realize at all or not and if so at what cost and gain.
Patents may be an unforeseen obstacle.